28.05.2017, 03:49 PM
Ja, das ist auf dem EVM sinnvoller gelöst.
Bleibt trotzdem noch:
"Connect IN, SW, and especially GND to
large copper areas to cool the chip for
improved thermal performance and long-
term reliability. "
Bleibt trotzdem noch:
"Connect IN, SW, and especially GND to
large copper areas to cool the chip for
improved thermal performance and long-
term reliability. "